APA600-PQ208B vs APA600-FPQG208 feature comparison

APA600-PQ208B Microchip Technology Inc

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APA600-FPQG208 Microchip Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description 0.50 MM PITCH, PLASTIC, QFP-208 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, QFP-208
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G208 S-PQFP-G208
JESD-609 Code e0 e3
Length 28 mm 28 mm
Moisture Sensitivity Level 3 3
Number of Equivalent Gates 600000 600000
Number of Inputs 158 158
Number of Logic Cells 21504 21504
Number of Outputs 158 158
Number of Terminals 208 208
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 600000 GATES 600000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP FQFP
Package Equivalence Code QFP208,1.2SQ,20 QFP208,1.2SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH FLATPACK, FINE PITCH
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B
Seated Height-Max 4.1 mm 4.1 mm
Supply Voltage-Max 2.7 V 2.7 V
Supply Voltage-Min 2.3 V 2.3 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 28 mm 28 mm
Base Number Matches 1 1
Clock Frequency-Max 180 MHz
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30

Compare APA600-PQ208B with alternatives

Compare APA600-FPQG208 with alternatives