APA600-FGG676M
vs
APA600-FGG676M
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
1 MM PITCH, ROHS COMPLIANT, FBGA-676
|
BGA, BGA676,26X26,40
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
180 MHz
|
180 MHz
|
| JESD-30 Code |
S-PBGA-B676
|
S-PBGA-B676
|
| JESD-609 Code |
e1
|
e1
|
| Length |
27 mm
|
27 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Equivalent Gates |
600000
|
600000
|
| Number of Inputs |
454
|
454
|
| Number of Logic Cells |
21504
|
21504
|
| Number of Outputs |
454
|
454
|
| Number of Terminals |
676
|
676
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
600000 GATES
|
600000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA676,26X26,40
|
BGA676,26X26,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
250
|
250
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.44 mm
|
2.44 mm
|
| Supply Voltage-Max |
2.7 V
|
2.7 V
|
| Supply Voltage-Min |
2.3 V
|
2.3 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
27 mm
|
27 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare APA600-FGG676M with alternatives
Compare APA600-FGG676M with alternatives