Findchips: Compare APA600-FGG676M vs APA600-FG676IX79

APA600-FGG676M vs APA600-FG676IX79 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	No
Part Life Cycle Code	Active	Transferred
Ihs Manufacturer	MICROCHIP TECHNOLOGY INC	MICROSEMI CORP
Package Description	1 MM PITCH, ROHS COMPLIANT, FBGA-676	BGA,
Reach Compliance Code	compliant	compliant
ECCN Code	3A001.A.2.C
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	180 MHz	180 MHz
JESD-30 Code	S-PBGA-B676	S-PBGA-B676
JESD-609 Code	e1	e0
Length	27 mm	27 mm
Moisture Sensitivity Level	3	3
Number of Equivalent Gates	600000	600000
Number of Inputs	454
Number of Logic Cells	21504
Number of Outputs	454
Number of Terminals	676	676
Operating Temperature-Max	125 °C	85 °C
Operating Temperature-Min	-55 °C	-40 °C
Organization	600000 GATES	600000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA676,26X26,40	BGA676,26X26,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	250
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.44 mm	2.44 mm
Supply Voltage-Max	2.7 V	2.7 V
Supply Voltage-Min	2.3 V	2.3 V
Supply Voltage-Nom	2.5 V	2.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	INDUSTRIAL
Terminal Finish	TIN SILVER COPPER	TIN LEAD
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30
Width	27 mm	27 mm
Base Number Matches	1	1
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays