Findchips: Compare APA600-FG256 vs APA600-FG256IX79

APA600-FG256 vs APA600-FG256IX79 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	No
Part Life Cycle Code	Transferred	Active
Ihs Manufacturer	MICROSEMI CORP	MICROCHIP TECHNOLOGY INC
Package Description	BGA, BGA256,16X16,40	1 MM PITCH, FBGA-256
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	180 MHz	180 MHz
JESD-30 Code	S-PBGA-B256	S-PBGA-B256
Length	17 mm	17 mm
Moisture Sensitivity Level	3	3
Number of Equivalent Gates	600000	600000
Number of Inputs	186	186
Number of Logic Cells	21504
Number of Outputs	186	186
Number of Terminals	256	256
Operating Temperature-Max	70 °C	85 °C
Operating Temperature-Min		-40 °C
Organization	600000 GATES	600000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA256,16X16,40	BGA256,16X16,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.8 mm	1.8 mm
Supply Voltage-Max	2.7 V	2.7 V
Supply Voltage-Min	2.3 V	2.3 V
Supply Voltage-Nom	2.5 V	2.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	COMMERCIAL	INDUSTRIAL
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Width	17 mm	17 mm
Base Number Matches	3	3
JESD-609 Code		e0
Terminal Finish		TIN LEAD
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays