APA600-BG456MX79 vs APA600-BG456I feature comparison

APA600-BG456MX79 Microsemi Corporation

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APA600-BG456I Actel Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP ACTEL CORP
Package Description BGA, 1.27 MM PITCH, PLASTIC, BGA-456
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01
Category CO2 Kg 12.2 12.2
Compliance Temperature Grade Military: -55C to +125C Industrial: -40C to +85C
Candidate List Date 2017-07-07 2010-12-15
Conflict Mineral Status DRC Conflict Free
Conflict Mineral Status Source CMRT V5.10
Clock Frequency-Max 180 MHz 180 MHz
JESD-30 Code S-PBGA-B456 S-PBGA-B456
Length 35 mm 35 mm
Number of Equivalent Gates 600000 600000
Number of Terminals 456 456
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 600000 GATES 600000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA456,26X26,50 BGA456,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.54 mm 2.54 mm
Supply Voltage-Max 2.7 V 2.7 V
Supply Voltage-Min 2.3 V 2.3 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
Base Number Matches 3 3
Rohs Code No
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of Inputs 356
Number of Logic Cells 21504
Number of Outputs 356
Terminal Finish TIN LEAD

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