APA150-PQG208IX95
vs
APA150-PQG208IX95
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
FQFP,
0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, QFP-208
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PQFP-G208
S-PQFP-G208
Length
28 mm
28 mm
Moisture Sensitivity Level
3
3
Number of Terminals
208
208
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FQFP
FQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel)
245
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.1 mm
4.1 mm
Supply Voltage-Max
2.7 V
2.7 V
Supply Voltage-Min
2.3 V
2.3 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
28 mm
28 mm
Base Number Matches
1
1