APA150-FG256I
vs
APA150-FGG256
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
1 MM PITCH, FBGA-256
BGA, BGA256,16X16,40
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
18 Weeks
Samacsys Manufacturer
Microchip
Clock Frequency-Max
180 MHz
180 MHz
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e1
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of Equivalent Gates
150000
150000
Number of Inputs
186
186
Number of Logic Cells
6144
6144
Number of Outputs
186
186
Number of Terminals
256
256
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
150000 GATES
150000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Packing Method
TRAY
Peak Reflow Temperature (Cel)
225
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.8 mm
1.8 mm
Supply Voltage-Max
2.7 V
2.7 V
Supply Voltage-Min
2.3 V
2.3 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
30
Width
17 mm
17 mm
Base Number Matches
3
3
Compare APA150-FG256I with alternatives
Compare APA150-FGG256 with alternatives