APA150-FG144IX79 vs APA150-FFG144X79 feature comparison

APA150-FG144IX79 Microsemi Corporation

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APA150-FFG144X79 Microsemi Corporation

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description LBGA, LBGA,
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 180 MHz 180 MHz
JESD-30 Code S-PBGA-B144 S-PBGA-B144
JESD-609 Code e0
Length 13 mm 13 mm
Moisture Sensitivity Level 3
Number of Equivalent Gates 150000 150000
Number of Terminals 144 144
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 150000 GATES 150000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA144,12X12,40 BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 2.7 V 2.7 V
Supply Voltage-Min 2.3 V 2.3 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
Base Number Matches 1 1
Number of Inputs 100
Number of Outputs 100

Compare APA150-FG144IX79 with alternatives

Compare APA150-FFG144X79 with alternatives