APA1000-FPQ208
vs
APA1000-PQG208M
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
0.50 MM PITCH, PLASTIC, QFP-208
|
FQFP, QFP208,1.2SQ,20
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
180 MHz
|
180 MHz
|
JESD-30 Code |
S-PQFP-G208
|
S-PQFP-G208
|
JESD-609 Code |
e0
|
e3
|
Length |
28 mm
|
28 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Equivalent Gates |
1000000
|
1000000
|
Number of Inputs |
158
|
158
|
Number of Logic Cells |
56320
|
56320
|
Number of Outputs |
158
|
158
|
Number of Terminals |
208
|
208
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
1000000 GATES
|
1000000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FQFP
|
FQFP
|
Package Equivalence Code |
QFP208,1.2SQ,20
|
QFP208,1.2SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, FINE PITCH
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.1 mm
|
4.1 mm
|
Supply Voltage-Max |
2.7 V
|
2.7 V
|
Supply Voltage-Min |
2.3 V
|
2.3 V
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
28 mm
|
28 mm
|
Base Number Matches |
3
|
3
|
ECCN Code |
|
3A001.A.2.C
|
Peak Reflow Temperature (Cel) |
|
245
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare APA1000-FPQ208 with alternatives
Compare APA1000-PQG208M with alternatives