APA1000-BGG456M
vs
APA1000-BG456B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-456
BGA, BGA456,26X26,50
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
32 Weeks
Samacsys Manufacturer
Microchip
Clock Frequency-Max
180 MHz
JESD-30 Code
S-PBGA-B456
S-PBGA-B456
JESD-609 Code
e1
Length
35 mm
35 mm
Moisture Sensitivity Level
3
3
Number of Equivalent Gates
1000000
1000000
Number of Inputs
356
356
Number of Logic Cells
56320
56320
Number of Outputs
356
356
Number of Terminals
456
456
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
1000000 GATES
1000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA456,26X26,50
BGA456,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Packing Method
TRAY
Peak Reflow Temperature (Cel)
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.54 mm
2.54 mm
Supply Voltage-Max
2.7 V
2.7 V
Supply Voltage-Min
2.3 V
2.3 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
35 mm
35 mm
Base Number Matches
3
3
Screening Level
MIL-STD-883 Class B
Compare APA1000-BGG456M with alternatives
Compare APA1000-BG456B with alternatives