AMRD-67132L-55SHXXX
vs
71321SA55TF
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
TEMIC SEMICONDUCTORS
INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code
unknown
not_compliant
Access Time-Max
55 ns
55 ns
JESD-30 Code
S-CQFP-F64
S-PQFP-G64
Memory Density
16384 bit
16384 bit
Memory IC Type
DUAL-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
64
64
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
2KX8
2KX8
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Voltage-Min
2 V
4.5 V
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
COMMERCIAL
Terminal Form
FLAT
GULL WING
Terminal Position
QUAD
QUAD
Base Number Matches
3
1
Pbfree Code
Rohs Code
Part Package Code
TQFP
Package Description
10 X 10 MM, 1.40 MM HEIGHT, STQFP-64
Pin Count
64
Manufacturer Package Code
PP64
ECCN Code
EAR99
HTS Code
8542.32.00.41
Additional Feature
INTERRUPT FLAG; AUTOMATIC POWER-DOWN
I/O Type
COMMON
JESD-609 Code
e0
Length
10 mm
Moisture Sensitivity Level
3
Package Code
TFQFP
Package Equivalence Code
QFP64,.47SQ,20
Peak Reflow Temperature (Cel)
240
Seated Height-Max
1.2 mm
Standby Current-Max
0.015 A
Supply Current-Max
0.155 mA
Terminal Finish
TIN LEAD
Terminal Pitch
0.5 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
10 mm
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