AMPAL16R6Q/BSA
vs
PAL20L10JM
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
NATIONAL SEMICONDUCTOR CORP
Package Description
,
DIP, DIP24,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programmable Logic Type
OT PLD
OT PLD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
2
3
Rohs Code
ECCN Code
3A001.A.2.C
Additional Feature
ACTIVE LOW OUTPUT
Architecture
PAL-TYPE
JESD-30 Code
R-GDIP-T24
JESD-609 Code
e0
Number of Dedicated Inputs
12
Number of I/O Lines
8
Number of Inputs
20
Number of Outputs
10
Number of Product Terms
40
Number of Terminals
24
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
12 DEDICATED INPUTS, 8 I/O
Output Function
COMBINATORIAL
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
DIP
Package Equivalence Code
DIP24,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE
Propagation Delay
60 ns
Qualification Status
Not Qualified
Seated Height-Max
5.715 mm
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Supply Voltage-Nom
5 V
Surface Mount
NO
Technology
TTL
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
7.62 mm
Compare AMPAL16R6Q/BSA with alternatives
Compare PAL20L10JM with alternatives