AMPAL16L8DC vs TIBPAL16R8-20MFK feature comparison

AMPAL16L8DC AMD

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TIBPAL16R8-20MFK Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC TEXAS INSTRUMENTS INC
Part Package Code DIP QFN
Package Description DIP, DIP20,.3 QCCN, LCC20,.35SQ
Pin Count 20 20
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Architecture PAL-TYPE PAL-TYPE
JESD-30 Code R-CDIP-T20 S-CQCC-N20
JESD-609 Code e0
Length 24.257 mm 8.89 mm
Number of Dedicated Inputs 10 8
Number of I/O Lines 6
Number of Inputs 16 8
Number of Outputs 8 8
Number of Product Terms 64 64
Number of Terminals 20 20
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Organization 10 DEDICATED INPUTS, 6 I/O 8 DEDICATED INPUTS, 0 I/O
Output Function COMBINATORIAL REGISTERED
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP QCCN
Package Equivalence Code DIP20,.3 LCC20,.35SQ
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER
Programmable Logic Type OT PLD OT PLD
Propagation Delay 35 ns 15 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 2.03 mm
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology TTL TTL
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 7.62 mm 8.89 mm
Base Number Matches 2 1
ECCN Code 3A001.A.2.C
Additional Feature POWER-UP RESET
Clock Frequency-Max 41.6 MHz
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare AMPAL16L8DC with alternatives

Compare TIBPAL16R8-20MFK with alternatives