AMPAL16L8DC
vs
TIBPAL16R8-20MFK
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
TEXAS INSTRUMENTS INC
Part Package Code
DIP
QFN
Package Description
DIP, DIP20,.3
QCCN, LCC20,.35SQ
Pin Count
20
20
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Architecture
PAL-TYPE
PAL-TYPE
JESD-30 Code
R-CDIP-T20
S-CQCC-N20
JESD-609 Code
e0
Length
24.257 mm
8.89 mm
Number of Dedicated Inputs
10
8
Number of I/O Lines
6
Number of Inputs
16
8
Number of Outputs
8
8
Number of Product Terms
64
64
Number of Terminals
20
20
Operating Temperature-Max
75 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
10 DEDICATED INPUTS, 6 I/O
8 DEDICATED INPUTS, 0 I/O
Output Function
COMBINATORIAL
REGISTERED
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
QCCN
Package Equivalence Code
DIP20,.3
LCC20,.35SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
Programmable Logic Type
OT PLD
OT PLD
Propagation Delay
35 ns
15 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
2.03 mm
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
TTL
TTL
Temperature Grade
COMMERCIAL EXTENDED
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Width
7.62 mm
8.89 mm
Base Number Matches
2
1
ECCN Code
3A001.A.2.C
Additional Feature
POWER-UP RESET
Clock Frequency-Max
41.6 MHz
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare AMPAL16L8DC with alternatives
Compare TIBPAL16R8-20MFK with alternatives