AMPAL16L8AL/BRA vs PAL16L8AJC feature comparison

AMPAL16L8AL/BRA AMD

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PAL16L8AJC National Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, DIP20,.3 DIP, DIP20,.3
Pin Count 20
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Architecture PAL-TYPE PAL-TYPE
JESD-30 Code R-CDIP-T20 R-GDIP-T20
JESD-609 Code e0 e0
Length 24.257 mm 24.51 mm
Number of Dedicated Inputs 10 10
Number of I/O Lines 6 6
Number of Inputs 16 16
Number of Outputs 8 8
Number of Product Terms 64 64
Number of Terminals 20 20
Operating Temperature-Max 125 °C 75 °C
Operating Temperature-Min -55 °C
Organization 10 DEDICATED INPUTS, 6 I/O 10 DEDICATED INPUTS, 6 I/O
Output Function COMBINATORIAL COMBINATORIAL
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type OT PLD OT PLD
Propagation Delay 30 ns 25 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL EXTENDED
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 4
Additional Feature ACTIVE LOW OUTPUT

Compare AMPAL16L8AL/BRA with alternatives

Compare PAL16L8AJC with alternatives