AMF06039K090.1%10PPM/KKP10 vs RP73C1J9K09BTDG feature comparison

AMF06039K090.1%10PPM/KKP10 Microtech GmbH Electronic

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RP73C1J9K09BTDG TE Connectivity

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROTECH GMBH ELECTRONIC TE CONNECTIVITY LTD
Reach Compliance Code compliant unknown
ECCN Code EAR99
Construction Chip Chip
JESD-609 Code e3
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.45 mm 0.45 mm
Package Length 1.6 mm 1.55 mm
Package Style SMT SMT
Package Width 0.85 mm 0.8 mm
Packing Method TR, 13 Inch TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.1 W 0.1 W
Reference Standard AEC-Q200 MIL-STD-202
Resistance 9090 Ω 9090 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0603 0603
Technology THIN FILM THIN FILM
Temperature Coefficient 10 ppm/°C 10 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Tolerance 0.1% 0.1%
Working Voltage 75 V 75 V
Base Number Matches 1 1
Package Description CHIP
Additional Feature HIGH PRECISION
Manufacturer Series RP73
Mounting Feature SURFACE MOUNT
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Series RP73
Surface Mount YES
Terminal Shape WRAPAROUND

Compare AMF06039K090.1%10PPM/KKP10 with alternatives

Compare RP73C1J9K09BTDG with alternatives