AM99C165-55DC vs 5962-8685914LC feature comparison

AM99C165-55DC AMD

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5962-8685914LC Integrated Device Technology Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP
Package Description DIP, DIP24,.3 DIP,
Pin Count 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
Additional Feature AUTOMATIC POWER-DOWN
I/O Type COMMON
JESD-30 Code R-GDIP-T24 R-CDIP-T24
JESD-609 Code e0 e4
Length 31.9405 mm 30.48 mm
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Ports 1
Number of Terminals 24 24
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 16KX4 16KX4
Output Characteristics 3-STATE
Output Enable YES
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.013 mm
Standby Current-Max 0.015 A
Standby Voltage-Min 2 V
Supply Current-Max 0.11 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 4
Screening Level MIL-STD-883

Compare AM99C165-55DC with alternatives

Compare 5962-8685914LC with alternatives