AM9511ADIB
vs
MD8232-3B
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ADVANCED MICRO DEVICES INC
|
| Package Description |
DIP,
|
DIP, DIP24,.6
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
|
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
2.08 MHz
|
3.125 MHz
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
R-GDIP-T24
|
R-CDIP-T24
|
| Length |
32.0675 mm
|
32.0675 mm
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Seated Height-Max |
5.588 mm
|
5.588 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
NMOS
|
MOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
15.24 mm
|
15.24 mm
|
| uPs/uCs/Peripheral ICs Type |
MATH PROCESSOR, COPROCESSOR
|
MATH PROCESSOR, COPROCESSOR
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
No
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
24
|
| ECCN Code |
|
3A001.A.2.C
|
| Barrel Shifter |
|
NO
|
| JESD-609 Code |
|
e0
|
| Package Equivalence Code |
|
DIP24,.6
|
| Qualification Status |
|
Not Qualified
|
| Screening Level |
|
MIL-STD-883 Class B (Modified)
|
| Supply Current-Max |
|
190 mA
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare MD8232-3B with alternatives