AM93L425PC
vs
MCM93425FM
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
MOTOROLA INC
Part Package Code
DIP
Package Description
DIP,
DIP, FL16,.3
Pin Count
16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
60 ns
60 ns
JESD-30 Code
R-PDIP-T16
R-GDIP-T16
Length
19.05 mm
19.495 mm
Memory Density
1024 bit
1024 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
1
1
Number of Functions
1
1
Number of Terminals
16
16
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
75 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
1KX1
1KX1
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
CMOS
Temperature Grade
COMMERCIAL EXTENDED
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Base Number Matches
2
3
JESD-609 Code
e0
Output Characteristics
3-STATE
Package Equivalence Code
FL16,.3
Supply Current-Max
0.17 mA
Terminal Finish
TIN LEAD
Compare AM93L425PC with alternatives
Compare MCM93425FM with alternatives