AM91L01BDM vs MAL5101CS feature comparison

AM91L01BDM AMD

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MAL5101CS Dynex Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC GEC PLESSEY SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP22,.4 DIP, DIP22,.4
Pin Count 22
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 400 ns 130 ns
I/O Type SEPARATE SEPARATE
JESD-30 Code R-CDIP-T22 R-CDIP-T22
JESD-609 Code e0 e0
Length 27.432 mm 27.94 mm
Memory Density 1024 bit 1024 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 22 22
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 256X4 256X4
Output Characteristics 3-STATE 3-STATE
Output Enable YES YES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP22,.4 DIP22,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class C MIL-STD-883 Class S
Seated Height-Max 5.08 mm 5.715 mm
Supply Current-Max 0.037 mA 0.015 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology NMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 10.16 mm 15.24 mm
Base Number Matches 1 4
Standby Current-Max 0.00075 A
Standby Voltage-Min 2 V
Total Dose 30k Rad(Si) V

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