AM9150-25DCB vs P4C150-25DMB feature comparison

AM9150-25DCB AMD

Buy Now Datasheet

P4C150-25DMB Pyramid Semiconductor Corporation

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC PYRAMID SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description DIP, DIP24,.3 DIP,
Pin Count 24 24
Reach Compliance Code unknown compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
JESD-30 Code R-GDIP-T24 R-GDIP-T24
JESD-609 Code e0 e0
Length 31.9405 mm
Memory Density 4096 bit 4096 bit
Memory IC Type STANDARD SRAM CACHE SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Ports 1
Number of Terminals 24 24
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 1KX4 1KX4
Output Characteristics 3-STATE
Output Enable YES
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology NMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 1
Screening Level MIL-STD-883 Class B

Compare AM9150-25DCB with alternatives

Compare P4C150-25DMB with alternatives