AM9130ADC
vs
AM9131DDC
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
DIP, DIP22,.4
|
DIP, DIP22,.4
|
Pin Count |
22
|
22
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
500 ns
|
250 ns
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
R-CDIP-T22
|
R-CDIP-T22
|
JESD-609 Code |
e0
|
e0
|
Length |
27.432 mm
|
27.432 mm
|
Memory Density |
4096 bit
|
4096 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
22
|
22
|
Number of Words |
1024 words
|
1024 words
|
Number of Words Code |
1000
|
1000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
1KX4
|
1KX4
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Enable |
YES
|
YES
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP22,.4
|
DIP22,.4
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.08 mm
|
5.08 mm
|
Supply Voltage-Max (Vsup) |
5.25 V
|
|
Supply Voltage-Min (Vsup) |
4.75 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
MOS
|
MOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
10.16 mm
|
10.16 mm
|
Base Number Matches |
4
|
4
|
Pbfree Code |
|
No
|
|
|
|
Compare AM9130ADC with alternatives
Compare AM9131DDC with alternatives