AM90C256-12PC
vs
MB81256-12Z
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code
DIP
Package Description
DIP, DIP16,.3
DIP,
Pin Count
16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
FAST PAGE
PAGE
Access Time-Max
120 ns
120 ns
Additional Feature
RAS ONLY REFRESH
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
I/O Type
SEPARATE
JESD-30 Code
R-PDIP-T16
R-GDIP-T16
JESD-609 Code
e0
Memory Density
262144 bit
262144 bit
Memory IC Type
FAST PAGE DRAM
PAGE MODE DRAM
Memory Width
1
1
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
16
16
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX1
256KX1
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
256
256
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
NMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
2
Length
19.3 mm
Compare AM90C256-12PC with alternatives
Compare MB81256-12Z with alternatives