AM9080ADM
vs
MC68A09ECL
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
DIP, DIP40,.6
DIP, DIP40,.6
Pin Count
40
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.31.00.01
Address Bus Width
16
Bit Size
8
8
Boundary Scan
NO
Clock Frequency-Max
2.08 MHz
External Data Bus Width
8
Format
FIXED POINT
Integrated Cache
NO
JESD-30 Code
R-CDIP-T40
R-XDIP-T40
JESD-609 Code
e0
e0
Length
52.324 mm
Low Power Mode
NO
Number of DMA Channels
Number of External Interrupts
1
Number of Serial I/Os
Number of Terminals
40
40
On Chip Data RAM Width
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP40,.6
DIP40,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Screening Level
MIL-STD-883 Class C
Seated Height-Max
5.715 mm
Speed
2.08 MHz
1.5 MHz
Supply Current-Max
60 mA
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
NMOS
MOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
1
3
Power Supplies
5 V
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