AM8228XC
vs
D8238
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
INTEL CORP
Part Package Code
DIE
DIP
Package Description
DIE,
DIP, DIP28,.6
Pin Count
28
28
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Bus Compatibility
9080; 8080A
8080A
JESD-30 Code
R-XUUC-N28
R-GDIP-T28
Number of Terminals
28
28
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
UNSPECIFIED
CERAMIC, GLASS-SEALED
Package Code
DIE
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
190 mA
190 mA
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
UPPER
DUAL
uPs/uCs/Peripheral ICs Type
SYSTEM INTERFACE LOGIC, CONTROL AND COMMAND SIGNAL GENERATOR
SYSTEM INTERFACE LOGIC, CONTROL AND COMMAND SIGNAL GENERATOR
Base Number Matches
1
2
Rohs Code
JESD-609 Code
e0
Length
37.15 mm
Package Equivalence Code
DIP28,.6
Seated Height-Max
5.72 mm
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
15.24 mm
Compare AM8228XC with alternatives
Compare D8238 with alternatives