AM79R79-3JC
vs
LE79R79-2FQCT
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
MICROSEMI CORP
|
| Part Package Code |
QFJ
|
QFN
|
| Package Description |
QCCJ, LDCC32,.5X.6
|
8 X 8 MM, GREEN, MO-220, QFN-32
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Battery Feed |
CONSTANT CURRENT
|
CONSTANT CURRENT
|
| Battery Supply |
-19 TO -75 V
|
-19 TO -75 V
|
| Hybrid |
2-4 CONVERSION
|
2-4 CONVERSION
|
| JESD-30 Code |
R-PQCC-J32
|
S-XQCC-N32
|
| JESD-609 Code |
e0
|
e3
|
| Length |
13.97 mm
|
8 mm
|
| Neg Supply Voltage-Nom |
-5 V
|
|
| Noise-Max |
12 dBrnC
|
79 dBrnC
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| PSRR-Min |
33 dB
|
30 dB
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
QCCJ
|
HVQCCN
|
| Package Equivalence Code |
LDCC32,.5X.6
|
LCC32,.35SQ,32
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.556 mm
|
1 mm
|
| Supply Current-Max |
9 mA
|
9 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Telecom IC Type |
SLIC
|
SLIC
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Matte Tin (Sn)
|
| Terminal Form |
J BEND
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
11.43 mm
|
8 mm
|
| Base Number Matches |
2
|
1
|
| Samacsys Manufacturer |
|
Microsemi Corporation
|
|
|
|
Compare AM79R79-3JC with alternatives
Compare LE79R79-2FQCT with alternatives