AM79R79-1JCT
vs
LE79R79-2FQC
feature comparison
| Part Life Cycle Code |
Transferred
|
End Of Life
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFJ
|
|
| Package Description |
QCCJ,
|
HVQCCN,
|
| Pin Count |
32
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| JESD-30 Code |
R-PQCC-J32
|
S-XQCC-N32
|
| Length |
13.97 mm
|
8 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
QCCJ
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
3.556 mm
|
1 mm
|
| Supply Current-Max |
9 mA
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
SLIC
|
SLIC
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
J BEND
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
11.43 mm
|
8 mm
|
| Base Number Matches |
4
|
4
|
| JESD-609 Code |
|
e3
|
| Technology |
|
BIPOLAR
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare AM79R79-1JCT with alternatives
Compare LE79R79-2FQC with alternatives