AM67C4013-35JC vs L8C403CM25 feature comparison

AM67C4013-35JC AMD

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L8C403CM25 LOGIC Devices Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC LOGIC DEVICES INC
Package Description DIP, DIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 20 ns 50 ns
Cycle Time 28.57 ns 65 ns
JESD-30 Code R-CDIP-T20 R-GDIP-T16
Length 24.257 mm 20.32 mm
Memory Density 256 bit 36864 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 4 9
Number of Functions 1 1
Number of Terminals 20 16
Number of Words 64 words 64 words
Number of Words Code 64 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Organization 64X4 4KX9
Output Characteristics 3-STATE 3-STATE
Output Enable YES YES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Current-Max 0.06 mA 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Rohs Code No
Part Package Code DIP
Pin Count 16
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225

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