AM5708BCBDJAR
vs
AM5708ACBDJEA
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
FCBGA-538
|
BGA,
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
5A992.C
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
16
|
16
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
38.4 MHz
|
38.4 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
NO
|
JESD-30 Code |
S-PBGA-B538
|
S-PBGA-B538
|
JESD-609 Code |
e1
|
|
Length |
17 mm
|
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
538
|
538
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
260
|
|
Seated Height-Max |
1.298 mm
|
|
Speed |
1000 MHz
|
1000 MHz
|
Supply Voltage-Max |
1.2 V
|
1.2 V
|
Supply Voltage-Min |
1.11 V
|
1.11 V
|
Supply Voltage-Nom |
1.15 V
|
1.15 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.65 mm
|
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
17 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Date Of Intro |
|
2017-02-18
|
|
|
|
Compare AM5708BCBDJAR with alternatives
Compare AM5708ACBDJEA with alternatives