AM5708BCBDJA
vs
AM5708BCBDJS
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
FCBGA-538
|
,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A992.C
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
16
|
|
Boundary Scan |
YES
|
|
Clock Frequency-Max |
38.4 MHz
|
|
External Data Bus Width |
32
|
|
Format |
FIXED POINT
|
|
Integrated Cache |
YES
|
|
JESD-30 Code |
S-PBGA-B538
|
|
JESD-609 Code |
e1
|
e1
|
Length |
17 mm
|
|
Low Power Mode |
YES
|
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
538
|
|
Operating Temperature-Max |
105 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
LFBGA
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
1.298 mm
|
|
Speed |
1000 MHz
|
|
Supply Voltage-Max |
1.2 V
|
|
Supply Voltage-Min |
1.11 V
|
|
Supply Voltage-Nom |
1.15 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
|
Terminal Pitch |
0.65 mm
|
|
Terminal Position |
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
17 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
3
|
1
|
|
|
|
Compare AM5708BCBDJA with alternatives
Compare AM5708BCBDJS with alternatives