AM5708BCBDJ
vs
AM5708BCBDJR
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Package Description
FCBGA-538
FCBGA-538
Reach Compliance Code
compliant
compliant
ECCN Code
5A992.C
5A992.C
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
Texas Instruments
Texas Instruments
Address Bus Width
16
16
Boundary Scan
YES
YES
Clock Frequency-Max
38.4 MHz
38.4 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B538
S-PBGA-B538
JESD-609 Code
e1
e1
Length
17 mm
17 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of Terminals
538
538
Operating Temperature-Max
90 °C
90 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Seated Height-Max
1.298 mm
1.298 mm
Speed
1000 MHz
1000 MHz
Supply Voltage-Max
1.2 V
1.2 V
Supply Voltage-Min
1.11 V
1.11 V
Supply Voltage-Nom
1.15 V
1.15 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
17 mm
17 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Compare AM5708BCBDJ with alternatives
Compare AM5708BCBDJR with alternatives