AM5708BCBDJ vs AM5708BCBDJR feature comparison

AM5708BCBDJ Texas Instruments

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AM5708BCBDJR Texas Instruments

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Package Description FCBGA-538 FCBGA-538
Reach Compliance Code compliant compliant
ECCN Code 5A992.C 5A992.C
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer Texas Instruments Texas Instruments
Address Bus Width 16 16
Boundary Scan YES YES
Clock Frequency-Max 38.4 MHz 38.4 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B538 S-PBGA-B538
JESD-609 Code e1 e1
Length 17 mm 17 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 538 538
Operating Temperature-Max 90 °C 90 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Seated Height-Max 1.298 mm 1.298 mm
Speed 1000 MHz 1000 MHz
Supply Voltage-Max 1.2 V 1.2 V
Supply Voltage-Min 1.11 V 1.11 V
Supply Voltage-Nom 1.15 V 1.15 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

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