AM54BDS128AGT89IT vs AM41DL3244GB85IS feature comparison

AM54BDS128AGT89IT Spansion

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AM41DL3244GB85IS Spansion

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code BGA BGA
Package Description LFBGA, 8 X 11.60 MM, FBGA-73
Pin Count 93 73
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature SRAM IS ORGANISED AS 1M X 16 STATIC RAM IS ORGANISED AS 512K X 8 OR 256K X 16; FLASH CAN ALSO BE ORGANISED AS 4M X 8
JESD-30 Code S-PBGA-B93 R-PBGA-B73
JESD-609 Code e0 e0
Length 10 mm 11.6 mm
Memory Density 134217728 bit 33554432 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 93 73
Number of Words 8388608 words 2097152 words
Number of Words Code 8000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 1.95 V 3.3 V
Supply Voltage-Min (Vsup) 1.65 V 2.7 V
Supply Voltage-Nom (Vsup) 1.8 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 10 mm 8 mm
Base Number Matches 1 1
Access Time-Max 85 ns
Mixed Memory Type FLASH+SRAM
Moisture Sensitivity Level 3
Package Equivalence Code BGA73,10X12,32
Peak Reflow Temperature (Cel) 260
Supply Current-Max 0.045 mA

Compare AM54BDS128AGT89IT with alternatives

Compare AM41DL3244GB85IS with alternatives