AM54BDS128AGT89FT
vs
AM41PDS3228DB11IT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
SPANSION INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
Package Description
LFBGA,
Pin Count
93
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.71
Additional Feature
SRAM IS ORGANISED AS 1M X 16
JESD-30 Code
S-PBGA-B93
R-PBGA-B73
JESD-609 Code
e1
Length
10 mm
Memory Density
134217728 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
Number of Functions
1
Number of Terminals
93
73
Number of Words
8388608 words
Number of Words Code
8000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
FBGA
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
Supply Voltage-Max (Vsup)
1.95 V
Supply Voltage-Min (Vsup)
1.65 V
Supply Voltage-Nom (Vsup)
1.8 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
10 mm
Base Number Matches
1
3
Access Time-Max
110 ns
Mixed Memory Type
FLASH+SRAM
Package Equivalence Code
BGA73,10X12,32
Power Supplies
2 V
Supply Current-Max
0.03 mA
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