AM45DL3208GT85IT vs AM45DL3208GT85IT feature comparison

AM45DL3208GT85IT AMD

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AM45DL3208GT85IT Spansion

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SPANSION INC
Part Package Code BGA BGA
Package Description LFBGA, BGA73,10X12,32 LFBGA,
Pin Count 73 73
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 85 ns
Additional Feature SRAM IS ORGANISED AS (1M X 8-BIT/ 512K X 16-BIT) STATIC RAM IS ORGANIZED AS 512K X 16/1M X 8
JESD-30 Code R-PBGA-B73 R-PBGA-B73
JESD-609 Code e0 e0
Length 11.6 mm 11.6 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+SRAM
Number of Functions 1 1
Number of Terminals 73 73
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA73,10X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Standby Current-Max 0.000005 A
Supply Current-Max 0.045 mA
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 1 1
Pbfree Code No
Moisture Sensitivity Level 3

Compare AM45DL3208GT85IT with alternatives

Compare AM45DL3208GT85IT with alternatives