AM42DL1624DT70IT vs AM41PDS3228DB10IT feature comparison

AM42DL1624DT70IT Spansion

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AM41PDS3228DB10IT Spansion

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code BGA BGA
Package Description LFBGA, 8 X 11.60 MM, FBGA-73
Pin Count 69 73
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature STATIC RAM IS ORGANIZED AS 256K X 16-BIT; FLASH CAN ALSO BE ORGANIZED AS 2M X 8 SRAM IS ORGANISED AS 512K X 16/1M X 8
JESD-30 Code R-PBGA-B69 R-PBGA-B73
JESD-609 Code e0 e0
Length 11 mm 11.6 mm
Memory Density 16777216 bit 33554432 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 69 73
Number of Words 1048576 words 2097152 words
Number of Words Code 1000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.3 V 2.2 V
Supply Voltage-Min (Vsup) 2.7 V 1.8 V
Supply Voltage-Nom (Vsup) 3 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 1 1
Pbfree Code No
Access Time-Max 100 ns
Mixed Memory Type FLASH+SRAM
Package Equivalence Code BGA73,10X12,32
Peak Reflow Temperature (Cel) 260
Supply Current-Max 0.03 mA

Compare AM42DL1624DT70IT with alternatives

Compare AM41PDS3228DB10IT with alternatives