AM42DL1622DT85IT vs AM54BDS128AGT89IT feature comparison

AM42DL1622DT85IT Spansion

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AM54BDS128AGT89IT AMD

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code BGA BGA
Package Description 8 X 11 MM, FBGA-69 LFBGA, BGA93,10X12,32
Pin Count 69 93
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 85 ns 85 ns
Additional Feature SRAM IS ORGANISED AS 128K X 16 SRAM IS ORGANISED AS 1M X 16
JESD-30 Code R-PBGA-B69 S-PBGA-B93
JESD-609 Code e0
Length 11 mm 10 mm
Memory Density 16777216 bit 134217728 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+SRAM FLASH+SRAM
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 69 93
Number of Words 1048576 words 8388608 words
Number of Words Code 1000000 8000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX16 8MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA69,10X10,32 BGA93,10X12,32
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Standby Current-Max 0.000005 A 0.00001 A
Supply Current-Max 0.045 mA 0.04 mA
Supply Voltage-Max (Vsup) 3.3 V 1.95 V
Supply Voltage-Min (Vsup) 2.7 V 1.65 V
Supply Voltage-Nom (Vsup) 3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 10 mm
Base Number Matches 2 2

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Compare AM54BDS128AGT89IT with alternatives