AM42BDS640AGTD9IT
vs
AM41PDS3228DB10IT
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
SPANSION INC
|
Reach Compliance Code |
compliant
|
not_compliant
|
Access Time-Max |
70 ns
|
100 ns
|
JESD-30 Code |
R-PBGA-B93
|
R-PBGA-B73
|
Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
Mixed Memory Type |
FLASH+SRAM
|
FLASH+SRAM
|
Number of Terminals |
93
|
73
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FBGA
|
LFBGA
|
Package Equivalence Code |
BGA93,10X12,32
|
BGA73,10X12,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Power Supplies |
1.8 V
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Standby Current-Max |
0.000008 A
|
|
Supply Current-Max |
0.025 mA
|
0.03 mA
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Base Number Matches |
3
|
3
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Part Package Code |
|
BGA
|
Package Description |
|
8 X 11.60 MM, FBGA-73
|
Pin Count |
|
73
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.32.00.71
|
Additional Feature |
|
SRAM IS ORGANISED AS 512K X 16/1M X 8
|
JESD-609 Code |
|
e0
|
Length |
|
11.6 mm
|
Memory Density |
|
33554432 bit
|
Memory Width |
|
16
|
Moisture Sensitivity Level |
|
3
|
Number of Functions |
|
1
|
Number of Words |
|
2097152 words
|
Number of Words Code |
|
2000000
|
Operating Mode |
|
ASYNCHRONOUS
|
Organization |
|
2MX16
|
Peak Reflow Temperature (Cel) |
|
260
|
Seated Height-Max |
|
1.4 mm
|
Supply Voltage-Max (Vsup) |
|
2.2 V
|
Supply Voltage-Min (Vsup) |
|
1.8 V
|
Terminal Finish |
|
TIN LEAD
|
Width |
|
8 mm
|
|
|
|
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