AM42BDS640AGT79IS
vs
IS71VPCF32CS04-8570BI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SPANSION INC
INTEGRATED SILICON SOLUTION INC
Part Package Code
BGA
BGA
Package Description
LFBGA,
8 X 11.60 MM, 0.80 MM PITCH, FBGA-73
Pin Count
93
73
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Additional Feature
ALSO CONTAINS 1M X 16 BIT SRAM
SRAM ORGANISATION IS 256K X 16/512K X 8
JESD-30 Code
R-PBGA-B93
R-PBGA-B73
JESD-609 Code
e0
e0
Length
11.6 mm
11.6 mm
Memory Density
67108864 bit
33554432 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
93
73
Number of Words
4194304 words
2097152 words
Number of Words Code
4000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
4MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max (Vsup)
1.95 V
3.3 V
Supply Voltage-Min (Vsup)
1.65 V
2.7 V
Supply Voltage-Nom (Vsup)
1.8 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
8 mm
Base Number Matches
1
1
Pbfree Code
Access Time-Max
85 ns
Mixed Memory Type
FLASH+SRAM
Package Equivalence Code
BGA73,10X12,32
Standby Current-Max
0.000005 A
Supply Current-Max
0.053 mA
Compare AM42BDS640AGT79IS with alternatives
Compare IS71VPCF32CS04-8570BI with alternatives