AM42BDS640AGBD9FT vs IS71V16F32CS08-7070BI feature comparison

AM42BDS640AGBD9FT Spansion

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IS71V16F32CS08-7070BI Integrated Silicon Solution Inc

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC INTEGRATED SILICON SOLUTION INC
Part Package Code BGA BGA
Package Description LFBGA, 8 X 11.60 MM, 0.80 MM PITCH, MINI, BGA-73
Pin Count 93 73
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature STATIC RAM IS ORGANISED AS 1M X 16 ALSO CONTAINS 512K X 16/1M X 8 SRAM
JESD-30 Code R-PBGA-B93 R-PBGA-B73
JESD-609 Code e1 e0
Length 11.6 mm 11.6 mm
Memory Density 67108864 bit 33554432 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 93 73
Number of Words 4194304 words 2097152 words
Number of Words Code 4000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 1.95 V 3.3 V
Supply Voltage-Min (Vsup) 1.65 V 2.7 V
Supply Voltage-Nom (Vsup) 1.8 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 1 1
Pbfree Code No
Access Time-Max 70 ns
Mixed Memory Type FLASH+SRAM
Package Equivalence Code BGA73,10X12,32
Standby Current-Max 0.000005 A
Supply Current-Max 0.053 mA

Compare AM42BDS640AGBD9FT with alternatives

Compare IS71V16F32CS08-7070BI with alternatives