AM41PDS3228DB11IT
vs
AM41DL6408H70FT
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SPANSION INC
SPANSION INC
Part Package Code
BGA
BGA
Package Description
8 X 11.60 MM, FBGA-73
LFBGA,
Pin Count
73
73
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
110 ns
Additional Feature
SRAM IS ORGANISED AS 512K X 16/1M X 8
STATIC RAM IS ORGANIZED AS 1M X 8 / 512K X 16; FLASH CAN ALSO BE ORGANIZED AS 8M X 8
JESD-30 Code
R-PBGA-B73
R-PBGA-B73
JESD-609 Code
e0
e1
Length
11.6 mm
11.6 mm
Memory Density
33554432 bit
67108864 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Mixed Memory Type
FLASH+SRAM
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
73
73
Number of Words
2097152 words
4194304 words
Number of Words Code
2000000
4000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA73,10X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Supply Current-Max
0.03 mA
Supply Voltage-Max (Vsup)
2.2 V
3.3 V
Supply Voltage-Min (Vsup)
1.8 V
2.7 V
Supply Voltage-Nom (Vsup)
2 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
8 mm
Base Number Matches
3
1
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