AM41DL3248GT85FS vs MB84VD22397EJ-85-PBS feature comparison

AM41DL3248GT85FS Spansion

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MB84VD22397EJ-85-PBS FUJITSU Semiconductor Limited

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Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer SPANSION INC FUJITSU LTD
Part Package Code BGA BGA
Package Description LFBGA, TFBGA, BGA71,8X12,32
Pin Count 73 71
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature SRAM IS ORGANIZED AS 512K X 16 FCRAM IS ORGANISED AS 1M X 16 AND OPERATES AT 2.7V TO 3.1V SUPPLY
JESD-30 Code R-PBGA-B73 R-PBGA-B71
JESD-609 Code e1 e0
Length 11.6 mm 11 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 73 71
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -30 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 7 mm
Base Number Matches 1 4
Pbfree Code No
Access Time-Max 85 ns
Mixed Memory Type FLASH+SRAM
Package Equivalence Code BGA71,8X12,32
Standby Current-Max 0.000005 A
Supply Current-Max 0.053 mA

Compare AM41DL3248GT85FS with alternatives

Compare MB84VD22397EJ-85-PBS with alternatives