AM41DL1624DB70IS
vs
AM42BDS640AGBD9FT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
SPANSION INC
Part Package Code
BGA
BGA
Package Description
LFBGA, BGA69,10X10,32
LFBGA,
Pin Count
69
93
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
70 ns
Additional Feature
STATIC RAM IS ORGANISED AS 512K X 8 OR 256K X 16; FLASH CAN ALSO BE ORGANISED AS 2M X 8
STATIC RAM IS ORGANISED AS 1M X 16
JESD-30 Code
R-PBGA-B69
R-PBGA-B93
JESD-609 Code
e0
e1
Length
11 mm
11.6 mm
Memory Density
16777216 bit
67108864 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Mixed Memory Type
FLASH+SRAM
Number of Functions
1
1
Number of Terminals
69
93
Number of Words
1048576 words
4194304 words
Number of Words Code
1000000
4000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA69,10X10,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Supply Current-Max
0.045 mA
Supply Voltage-Max (Vsup)
3.3 V
1.95 V
Supply Voltage-Min (Vsup)
2.7 V
1.65 V
Supply Voltage-Nom (Vsup)
3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
8 mm
Base Number Matches
2
1
Compare AM41DL1624DB70IS with alternatives
Compare AM42BDS640AGBD9FT with alternatives