AM3715CBPD100
vs
DM3730CBC100
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
12 X 12 MM, 0.50 MM PITCH, GREEN, PLASTIC, BGA-515
0.50 MM PITCH, GREEN, PLASTIC, FCBGA-515
Pin Count
515
515
Reach Compliance Code
compliant
compliant
ECCN Code
5A992.C
5A992.C
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
26
26
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
54 MHz
54 MHz
External Data Bus Width
16
16
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B515
S-PBGA-B515
JESD-609 Code
e1
e1
Length
12 mm
14 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of Terminals
515
515
On Chip Data RAM Width
8
8
Operating Temperature-Max
90 °C
90 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
VFBGA
Package Equivalence Code
BGA515,28X28,16
BGA515,26X26,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
RAM (words)
65536
16384
Seated Height-Max
0.71 mm
1 mm
Speed
1000 MHz
1000 MHz
Supply Current-Max
900 mA
37 mA
Supply Voltage-Max
1.2 V
1.2 V
Supply Voltage-Min
0.9 V
1.08 V
Supply Voltage-Nom
1.1 V
1.14 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
12 mm
14 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Number of DMA Channels
128
Compare AM3715CBPD100 with alternatives
Compare DM3730CBC100 with alternatives