AM3358ZCZA50
vs
4450HG/3-K
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
EXAR CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LFBGA,
|
HBGA,
|
| Pin Count |
324
|
324
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
|
14
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
26 MHz
|
|
| External Data Bus Width |
16
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
NO
|
| JESD-30 Code |
S-PBGA-B324
|
S-PBGA-B324
|
| Length |
15 mm
|
19 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
324
|
324
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
HBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, HEAT SINK/SLUG
|
| Seated Height-Max |
1.4 mm
|
2 mm
|
| Speed |
500 MHz
|
200 MHz
|
| Supply Voltage-Max |
1.15 V
|
1.03 V
|
| Supply Voltage-Min |
1.06 V
|
0.97 V
|
| Supply Voltage-Nom |
1.1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
15 mm
|
19 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e1
|
| Moisture Sensitivity Level |
|
4
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Peak Reflow Temperature (Cel) |
|
245
|
| Qualification Status |
|
Not Qualified
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare AM3358ZCZA50 with alternatives
Compare 4450HG/3-K with alternatives