AM3354BZCZA80
vs
AM3354BZCZ80
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Package Description
LFBGA, BGA324,18X18,32
NFBGA-324
Reach Compliance Code
compliant
compliant
ECCN Code
5A992.C
5A992.C
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
Texas Instruments
Texas Instruments
Address Bus Width
28
28
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
26 MHz
26 MHz
External Data Bus Width
16
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B324
S-PBGA-B324
JESD-609 Code
e1
e1
Length
15 mm
15 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of DMA Channels
64
64
Number of Terminals
324
324
On Chip Data RAM Width
8
8
Operating Temperature-Max
105 °C
90 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA324,18X18,32
BGA324,18X18,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
RAM (words)
131072
131072
Seated Height-Max
1.4 mm
1.4 mm
Speed
800 MHz
800 MHz
Supply Current-Max
400 mA
400 mA
Supply Voltage-Max
1.326 V
1.326 V
Supply Voltage-Min
1.21 V
1.21 V
Supply Voltage-Nom
1.26 V
1.26 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
15 mm
15 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Compare AM3354BZCZA80 with alternatives
Compare AM3354BZCZ80 with alternatives