AM29SL800CT-120ED
vs
MBM29SL800BD-12TR
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SPANSION INC
FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code
TSOP1
TSOP1
Package Description
TSOP1,
PLASTIC, REVERSE, TSOP1-48
Pin Count
48
48
Reach Compliance Code
compliant
unknown
Access Time-Max
120 ns
120 ns
Additional Feature
20 YEAR DATA RETENTION
Alternate Memory Width
8
8
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
JESD-609 Code
e3
Length
18.4 mm
18.4 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
512KX16
512KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TSOP1-R
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
1.8 V
1.8 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
2.2 V
2.2 V
Supply Voltage-Min (Vsup)
1.8 V
1.8 V
Supply Voltage-Nom (Vsup)
2 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
12 mm
12 mm
Base Number Matches
1
3
ECCN Code
EAR99
HTS Code
8542.32.00.51
Boot Block
BOTTOM
Type
NOR TYPE
Compare AM29SL800CT-120ED with alternatives
Compare MBM29SL800BD-12TR with alternatives