AM29SL800BB170WBI vs AM29SL800BT-170WBC feature comparison

AM29SL800BB170WBI Spansion

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AM29SL800BT-170WBC Spansion

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code BGA BGA
Package Description 6 X 9 MM, 0.80 MM PITCH, FBGA-48 TFBGA,
Pin Count 48 48
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 170 ns 170 ns
Additional Feature USER CONFIGURABLE AS 512K X 16
Boot Block BOTTOM
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e0 e0
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1MX8 1MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 1.8 V 1.8 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 2.2 V 2.2 V
Supply Voltage-Min (Vsup) 1.8 V 1.8 V
Supply Voltage-Nom (Vsup) 2 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Type NOR TYPE
Base Number Matches 2 2
Pbfree Code No
Alternate Memory Width 16
Length 9 mm
Peak Reflow Temperature (Cel) 240
Seated Height-Max 1.2 mm
Terminal Pitch 0.8 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 6 mm

Compare AM29SL800BB170WBI with alternatives

Compare AM29SL800BT-170WBC with alternatives