AM29SL800BB-170WBI vs AM29SL800BT170WBI feature comparison

AM29SL800BB-170WBI Spansion

Buy Now Datasheet

AM29SL800BT170WBI Spansion

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code BGA BGA
Package Description TFBGA, 6 X 9 MM, 0.80 MM PITCH, FBGA-48
Pin Count 48 48
Reach Compliance Code compliant compliant
Access Time-Max 170 ns 170 ns
Alternate Memory Width 16
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e0 e0
Length 9 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX8 1MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Programming Voltage 1.8 V 1.8 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 2.2 V 2.2 V
Supply Voltage-Min (Vsup) 1.8 V 1.8 V
Supply Voltage-Nom (Vsup) 2 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 6 mm
Base Number Matches 2 2
ECCN Code EAR99
HTS Code 8542.32.00.51
Additional Feature USER CONFIGURABLE AS 512K X 16
Boot Block TOP
Type NOR TYPE

Compare AM29SL800BB-170WBI with alternatives

Compare AM29SL800BT170WBI with alternatives