AM29SL400DB100WAF
vs
AM29SL400DB100WAI
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
ADVANCED MICRO DEVICES INC
|
Reach Compliance Code |
compliant
|
unknown
|
Access Time-Max |
100 ns
|
|
Alternate Memory Width |
8
|
|
Boot Block |
BOTTOM
|
|
Command User Interface |
YES
|
|
Data Polling |
YES
|
|
Endurance |
1000000 Write/Erase Cycles
|
|
JESD-30 Code |
R-PBGA-B48
|
|
Memory Density |
4194304 bit
|
|
Memory IC Type |
FLASH
|
|
Number of Sectors/Size |
1,2,1,7
|
|
Number of Terminals |
48
|
|
Number of Words |
262144 words
|
|
Number of Words Code |
256000
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
256KX16
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
FBGA
|
|
Package Equivalence Code |
BGA48,6X8,32
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
GRID ARRAY, FINE PITCH
|
|
Parallel/Serial |
PARALLEL
|
|
Power Supplies |
1.8 V
|
|
Qualification Status |
Not Qualified
|
|
Ready/Busy |
YES
|
|
Sector Size |
16K,8K,32K,64K
|
|
Standby Current-Max |
0.000005 A
|
|
Supply Current-Max |
0.03 mA
|
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
0.8 mm
|
|
Terminal Position |
BOTTOM
|
|
Toggle Bit |
YES
|
|
Type |
NOR TYPE
|
|
Base Number Matches |
3
|
3
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.32.00.51
|
|
|
|