AM29SL160CB100EC vs AM29F160DT90EE feature comparison

AM29SL160CB100EC Spansion

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AM29F160DT90EE AMD

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code TSOP1 TSOP
Package Description TSOP1, SOP,
Pin Count 48 48
Reach Compliance Code compliant unknown
Access Time-Max 100 ns 90 ns
Alternate Memory Width 16
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e0
Length 18.4 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 2MX8 2MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Programming Voltage 1.8 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 2.2 V 5.5 V
Supply Voltage-Min (Vsup) 1.8 V 4.5 V
Supply Voltage-Nom (Vsup) 2 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 12 mm
Base Number Matches 3 1
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Additional Feature CONFG AS 1M X 16; 1000K WRITE CYCLES MIN; DATA RETENTION 20 YEARS; TOP BOOT BLOCK
Boot Block TOP
Data Retention Time-Min 20
Type NOR TYPE

Compare AM29SL160CB100EC with alternatives

Compare AM29F160DT90EE with alternatives