AM29SL160CB-150WCF
vs
M24C64-WBN6G/P
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
SPANSION INC
|
STMICROELECTRONICS
|
| Part Package Code |
BGA
|
DIP
|
| Package Description |
TFBGA, BGA48,6X8,32
|
DIP, DIP8,.3
|
| Pin Count |
48
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| Access Time-Max |
150 ns
|
|
| Alternate Memory Width |
8
|
|
| Boot Block |
BOTTOM
|
|
| Command User Interface |
YES
|
|
| Common Flash Interface |
YES
|
|
| Data Polling |
YES
|
|
| JESD-30 Code |
R-PBGA-B48
|
R-PDIP-T8
|
| JESD-609 Code |
e1
|
e3
|
| Length |
9 mm
|
9.27 mm
|
| Memory Density |
16777216 bit
|
65536 bit
|
| Memory IC Type |
FLASH
|
EEPROM
|
| Memory Width |
16
|
8
|
| Moisture Sensitivity Level |
3
|
NOT APPLICABLE
|
| Number of Functions |
1
|
1
|
| Number of Sectors/Size |
8,31
|
|
| Number of Terminals |
48
|
8
|
| Number of Words |
1048576 words
|
8192 words
|
| Number of Words Code |
1000000
|
8000
|
| Operating Mode |
ASYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
1MX16
|
8KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
DIP
|
| Package Equivalence Code |
BGA48,6X8,32
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Power Supplies |
2 V
|
3/5 V
|
| Programming Voltage |
1.8 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Ready/Busy |
YES
|
|
| Seated Height-Max |
1.2 mm
|
5.33 mm
|
| Sector Size |
8K,64K
|
|
| Standby Current-Max |
0.000005 A
|
0.000002 A
|
| Supply Current-Max |
0.03 mA
|
0.005 mA
|
| Supply Voltage-Max (Vsup) |
2.2 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
2.5 V
|
| Supply Voltage-Nom (Vsup) |
2 V
|
2.7 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
Tin (Sn)
|
| Terminal Form |
BALL
|
THROUGH-HOLE
|
| Terminal Pitch |
0.8 mm
|
2.54 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
NOT SPECIFIED
|
| Toggle Bit |
YES
|
|
| Type |
NOR TYPE
|
|
| Width |
8 mm
|
6.37 mm
|
| Base Number Matches |
3
|
3
|
| Pbfree Code |
|
Yes
|
| Clock Frequency-Max (fCLK) |
|
0.4 MHz
|
| Data Retention Time-Min |
|
40
|
| Endurance |
|
1000000 Write/Erase Cycles
|
| I2C Control Byte |
|
1010DDDR
|
| Serial Bus Type |
|
I2C
|
| Write Cycle Time-Max (tWC) |
|
5 ms
|
| Write Protection |
|
HARDWARE
|
|
|
|
Compare AM29SL160CB-150WCF with alternatives
Compare M24C64-WBN6G/P with alternatives